DS-10 is a machine designed to retrieve chips from input carriers, perform visual alignment inspection (or include AOI functionality if required), and then place them onto another output carrier. In addition to general sorting functions, it can classify output end based on binning mode specified by map data. All carriers can be quickly replaced according to customer requirements (applicable for Disco Frames up to 8 inches).
- Real-time Confirmation: Instantly verifies the picking status after picking to prevent potential damage caused by picking errors.
- Pre-placement Verification: Confirms chip position before placement to ensure placement accuracy and quality.
- Foreign Object Inspection: Checks for foreign objects before placement to avoid chip stacking issues.
- Integration with Wafer Mapping Data: Capable of integrating wafer mapping data for production.
- Customized Output Sorting: Can classify output end based on binning mode specified by map data.
Product Specifications:
- Wafer size: Compatible with 6”/8” Disco Frames
- Chip size: 0.2mm x 0.2mm ~ 15mm x 15mm, T≥100um
- Cycle Time: Single-arm 3 sec./chips (1.2 k UPH) under the following conditions: Wafer to tray, continuous picking of single chips from Bin1. Chip size 4mm x 4mm, T= 350um. Using UV tape (excluding UV film peeling time)
- Place Accuracy: X, Y ≤±30um & Angle ≤±1° @3σ (for Chip Size 4mm x 4mm, with magnification 1x or higher)
- Wafer table: Optional 6”/8” Wafer Disco Frame, Waffle Tray (Gel Pak), and GR4 ~ GR6 expansion ring (with fixture conversion). Chuck installation possible for A to B/B to C operations. θ adjustable within ±15°
- Bin Tray table: Optional 6”/8” Wafer Disco Frame, Waffle Tray (Gel Pak), and GR4 ~ GR6 expansion ring (with fixture conversion)
- Wafer, Alignment, Bin, Tray CCD: Mega-Pixel mono Camera. High-resolution lens. LED light source utilized.